Aimed at delivering Ultra-Low Power for next-generation multimedia and computing experiences

SAN FRANCISCO, Feb. 22, 2011 /PRNewswire/ — Texas Instruments Incorporated (TI) (NYSE: TXN) and the Massachusetts Institute of Technology (MIT) today presented a joint research paper detailing design methodologies for a 28-nanometer (nm) mobile applications processor at the 2011 International Solid-State Circuits Conference (ISSCC). The paper—”A 28nm 0.6V Low Power Digital Signal Processor (DSP) for Mobile Applications”—demonstrates that a DSP is capable of scaling from high-performance mode at 1.0 volts down to an ultra-low power (ULP) mode at 0.6 volts (V). This DSP is one of the first system-level, low voltage, 28nm designs for the mobile device market, demonstrating TI’s continued commitment to enabling lower power and extended battery life in mobile devices running advanced applications.

“As the multimedia and computing capabilities of TI’s OMAP™ platform-based smartphones, tablets and other mobile devices increase, there is a continually expanding gap between performance demands and battery capacity,” said Gordon Gammie, Distinguished Member of the Technical Staff at TI and ISSCC presenter. “TI believes that 28nm process technology advancements, developed in tandem with TI and MIT‘s low power circuit and methodology collaboration, gives us the right knowledge base to successfully meet the next-generation processing demands within the future mobile power envelope.”

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